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Description
- 1x 2390 Tie Point Solderless Breadboard
Size
- 165.5 x 176 x 8.5 mm
- Bottom plate: 185 x 222 x 1 mm
- Tie-point: 2390
- Insulation Material: ABS
- Rated Voltage: 300 V
- Rated Current: 3 - 5 A
- Wire Range: 20 - 29 AWG
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